Xiaomi Also Unveils Xuanjie O3 Flagship Phone SoC and O100 AI Accelerator Alongside D100

At the same August 24 event where it revealed the D100 auto chip, Xiaomi unveiled two additional in-house chips: the Xuanjie O3, a 3nm flagship smartphone SoC that scored 5.22 million points on AnTuTu — the first mobile processor to break the 5-million mark and the first to support LPDDR6 memory — and the Xuanjie O100, a 6nm AI accelerator built for near-memory, on-device inference across phones, cars, and robotics with 1.22Tbps of bandwidth. The O3 will debut in the Xiaomi 18 Fold and Pad 9 Pro Max in September 2026; the O100 is slated for commercial availability in 2027. Reuters reported the O3 is manufactured on TSMC's 3nm node. The three-chip rollout (O3, O100, D100) took 459 days to develop and is backed by more than 21 billion yuan (~$3.1B) in Xiaomi silicon R&D spending since the program restarted, with roughly 3,000 engineers involved.