Xiaomi Unveils 3nm Xring D100 Smart-Driving Chip, Targets 2027 Commercial Deployment

Xiaomi unveiled the Xring D100 on August 24, its first in-house smart-driving chip and, per the company, China's first high-computing-power ADAS chip built on a 3-nanometer process, Reuters and Bloomberg reported. The chip is manufactured by TSMC and pairs a 20-core high-performance CPU with a 16-core neural processing unit, supporting up to 160GB of unified memory and capable of running large language models with as many as 200 billion parameters locally. Xiaomi said the D100 has completed validation and is scheduled for commercial use in 2027, with an initial rollout in desktop AI terminals ahead of vehicle deployment. The company has invested more than 21 billion yuan (~$3.1 billion) in chip development since restarting its silicon program and has assembled roughly 3,000 engineers on the effort, positioning Xiaomi alongside Nio, Li Auto, XPeng, and BYD in a race among Chinese automakers to develop proprietary smart-driving silicon to cut costs and tighten AI integration.