SEMICON China 2026 Opens in Shanghai with Focus on AI-Semiconductor Integration

SEMICON China 2026 opened at the Shanghai New International Expo Centre with 1,500 exhibitors and over 5,000 booths — the largest edition in the event's history. SEMI China President Lily Feng highlighted that China's global output share for 22nm–40nm process nodes will climb from 37% to 42% by 2028, reflecting continued domestic capacity expansion. IBS CEO Handel Jones cited global AI and data center capital expenditure reaching approximately $600 billion in 2026, up sharply from $110 billion in 2020. The conference spotlighted advanced packaging, chiplet integration, and domestic equipment as the three pillars of China's semiconductor self-sufficiency strategy under the 15th Five-Year Plan. China-developed wafer processing and inspection tools drew significant attention, signaling growing depth in the domestic equipment ecosystem.